SMT placement, through-hole and hand solder, first article, inspection and packing — on one floor in Shenzhen, run by the engineer who quoted the build.
Everything below happens in-house. Anything outside it is quoted as outside it, not quietly subcontracted.
Your pick-and-place file drives the line. Fine-pitch QFP and QFN, 0402 and up, reflow immediately after placement.
Hand and selective solder for connectors, headers and parts the placement machine cannot seat.
On a new build, the first board is checked against your files and photographed on request, before the lot runs.
Magnification check of the finished lot. Placement, polarity and solder joints checked during the run, not only at the end.
Electrical test where your design calls for it. If your board needs a fixture, that is quoted separately as NRE.
ESD packing, quantity count and a packing list that matches what is in the box.
No BOM yet? Send the Gerber and a photo of the board. We will tell you what is missing instead of guessing.
Board size, layer count and minimum component size are confirmed per build. We quote the range we have actually run for your design.
A generic capability table is easy to copy and easy to get wrong. We would rather answer your board than publish a range we have never held to.